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Studies on die-to-substrate interconnects for High-Q PCB inductors

Pourakbar, Mohammadreza, Linton, L, Rivet, F and Faulkner, Michael (2013) Studies on die-to-substrate interconnects for High-Q PCB inductors. Proceedings of the 2013 IEEE International Conference on Electronics, Circuits, and Systems. 633 - 636.

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Item Type: Article
Uncontrolled Keywords: wireless communication; die-to-substrate interconnections; solder ball; copper pillar; Q-factor; silicon chip
Subjects: FOR Classification > 0906 Electrical and Electronic Engineering
FOR Classification > 1099 Other Technology
Faculty/School/Research Centre/Department > School of Engineering and Science
Depositing User: Symplectic Elements
Date Deposited: 11 Aug 2016 06:50
Last Modified: 01 Jun 2017 11:51
URI: http://vuir.vu.edu.au/id/eprint/31186
DOI: https://doi.org/10.1109/ICECS.2013.6815494
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Citations in Scopus: 0 - View on Scopus

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