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A review on carbon-based materials as on-chip interconnects

Hatef, Sadeghi and Redoute, Jean-Michel and Lai, Daniel and Ahmadi, Mohammad and Ismail, Razali (2011) A review on carbon-based materials as on-chip interconnects. In: Smart Nano-Micro Materials and Devices. Juodkazis, Saulius and Gu, Min, eds. Proceedings of SPIE Series 8204 . Society of Photo-Optical Instrumentation Engineers (SPIE), United States.

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Abstract

Interconnect wires are major technology components of modern high-speed integrated circuits. To overcome the latter's degradation caused by increasing miniaturization, there is an urgent need to look for alternative technologies. Since carbon based materials generate promising results, this paper focuses on describing the electrical properties of carbon based materials, in particular the use of graphene nanoribbon (GNR) as well as trilayer graphene nanoribbon (TGN) as next generation interconnects: since the conductance of TGN is less affected by external fields compared to GNR, it forms an improved choice for on-chip interconnects. The conductance model of TGN is derived and discussed in detail.

Item Type: Book Section
ISBN: 9780819488459 (print) 0819488453 (print)
Uncontrolled Keywords: ResPubID22858, carbon, graphene, integrated circuits
Subjects: Faculty/School/Research Centre/Department > Centre for Telecommunications and Micro-Electronics (CTME)
FOR Classification > 0906 Electrical and Electronic Engineering
SEO Classification > 970111 Expanding Knowledge in the Medical and Health Sciences
Related URLs:
Depositing User: VUIR
Date Deposited: 19 Jan 2014 00:17
Last Modified: 19 Jan 2014 00:17
URI: http://vuir.vu.edu.au/id/eprint/7678
DOI: 10.1117/12.903196
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Citations in Scopus: 0 - View on Scopus

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