Studies on die-to-substrate interconnects for High-Q PCB inductors
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Pourakbar, Mohammadreza, Linton, L, Rivet, F and Faulkner, Michael (2013) Studies on die-to-substrate interconnects for High-Q PCB inductors. Proceedings of the 2013 IEEE International Conference on Electronics, Circuits, and Systems. 633 - 636.
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| Item type | Article |
| URI | https://vuir.vu.edu.au/id/eprint/31186 |
| DOI | 10.1109/ICECS.2013.6815494 |
| Official URL | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?... |
| Subjects | Historical > FOR Classification > 0906 Electrical and Electronic Engineering Historical > FOR Classification > 1099 Other Technology Historical > Faculty/School/Research Centre/Department > School of Engineering and Science |
| Keywords | wireless communication; die-to-substrate interconnections; solder ball; copper pillar; Q-factor; silicon chip |
| Citations in Scopus | 0 - View on Scopus |
| Download/View statistics | View download statistics for this item |
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