Studies on die-to-substrate interconnects for High-Q PCB inductors

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Pourakbar, Mohammadreza, Linton, L, Rivet, F and Faulkner, Michael (2013) Studies on die-to-substrate interconnects for High-Q PCB inductors. Proceedings of the 2013 IEEE International Conference on Electronics, Circuits, and Systems. 633 - 636.

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Item type Article
URI https://vuir.vu.edu.au/id/eprint/31186
DOI https://doi.org/10.1109/ICECS.2013.6815494
Official URL http://ieeexplore.ieee.org/xpl/articleDetails.jsp?...
Subjects Historical > FOR Classification > 0906 Electrical and Electronic Engineering
Historical > FOR Classification > 1099 Other Technology
Historical > Faculty/School/Research Centre/Department > School of Engineering and Science
Keywords wireless communication; die-to-substrate interconnections; solder ball; copper pillar; Q-factor; silicon chip
Citations in Scopus 0 - View on Scopus
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