A review on carbon-based materials as on-chip interconnects

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Hatef, Sadeghi, Redoute, Jean-Michel, Lai, Daniel, Ahmadi, Mohammad and Ismail, Razali (2011) A review on carbon-based materials as on-chip interconnects. In: Smart Nano-Micro Materials and Devices. Juodkazis, Saulius and Gu, Min, eds. Proceedings of SPIE Series 8204 . Society of Photo-Optical Instrumentation Engineers (SPIE), United States.


Interconnect wires are major technology components of modern high-speed integrated circuits. To overcome the latter's degradation caused by increasing miniaturization, there is an urgent need to look for alternative technologies. Since carbon based materials generate promising results, this paper focuses on describing the electrical properties of carbon based materials, in particular the use of graphene nanoribbon (GNR) as well as trilayer graphene nanoribbon (TGN) as next generation interconnects: since the conductance of TGN is less affected by external fields compared to GNR, it forms an improved choice for on-chip interconnects. The conductance model of TGN is derived and discussed in detail.

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Item type Book Section
URI https://vuir.vu.edu.au/id/eprint/7678
DOI 10.1117/12.903196
Official URL http://spie.org/x648.html?product_id=903196
ISBN 9780819488459 (print) 0819488453 (print)
Subjects Historical > Faculty/School/Research Centre/Department > Centre for Telecommunications and Micro-Electronics (CTME)
Historical > FOR Classification > 0906 Electrical and Electronic Engineering
Historical > SEO Classification > 970111 Expanding Knowledge in the Medical and Health Sciences
Keywords ResPubID22858, carbon, graphene, integrated circuits
Citations in Scopus 2 - View on Scopus
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